PI Aerogel Insulation Film
IBIH has successfully developed flexible polyimide aerogel film. The film boasts a flat surface, thickness deviation within ±15μm, thermal conductivity of 0.021W/(m·K), density of 0.1~0.15g/cm³, high hydrophobicity, bendability, and machinability.
- OVERVIEW
- PRODUCT PARAMETERS
- APPLICATION FIELD
-
Low Dk and Df
Ultra-low dielectric constant (Dk),Ultra-low loss tangent (Df),RF transparency; -
Low thermal conductivity
Thermal conductivity as low as 0.021 W/(m·K); -
Thin profile and flexible
Smooth surface finish with thickness tolerance of ±15μm，Density as low as 0.1 g/cm³.
Product Features
Contact our engineering team to discuss
Application Field
Engineered for advanced thermal management across 3C electronics, delivering critical heat dissipation solutions for: Microelectronics & quantum computing chipsets, Portable devices (Tablets/Laptops), 5G/6G RF antenna arrays, Photovoltaic modules.
