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Thermal Insulation For Consumer Electronics

In 3C devices, Aerogel Foam or PI Aerogel Insulation Film are directly applied through conformal wrapping or surface lamination onto heat-generating components, delivering precise thermal management at the source. Ideal for efficient thermal management in electronic devices operating within confined spaces, including: Smartphones & Tablets, Laptops & Notebooks, AR/VR Devices, Wearables (Smart watches, Fitness Trackers), Flexible Electronics.
  • Excellent Thermal Stability

    Maintains stable performance at high temperatures, enabling reliable heat dissipation in electronic devices.
  • Superior Electrical Insulation

    Acts as a physical barrier between components with minimal RF interference.
  • Particle-Free

    Eliminates particle shedding, posing no health risk to users, operators, or the work environment.

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