Thermal Insulation For Consumer Electronics
In 3C devices, Aerogel Foam or PI Aerogel Insulation Film are directly applied through conformal wrapping or surface lamination onto heat-generating components, delivering precise thermal management at the source. Ideal for efficient thermal management in electronic devices operating within confined spaces, including: Smartphones & Tablets, Laptops & Notebooks, AR/VR Devices, Wearables (Smart watches, Fitness Trackers), Flexible Electronics.
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Excellent Thermal Stability
Maintains stable performance at high temperatures, enabling reliable heat dissipation in electronic devices. -
Superior Electrical Insulation
Acts as a physical barrier between components with minimal RF interference. -
Particle-Free
Eliminates particle shedding, posing no health risk to users, operators, or the work environment.